NGUYEN , C. N.; DUONG , H. N.; DINH , V. Ánh. Research on the interconnection technologies between dies in the three-dimensional integrated circuits (3-d ics). Journal of Technical Education Science, [S. l.], v. 7, n. 1, p. 35–40, 2012. Disponível em: https://www.jte.edu.vn/index.php/jte/article/view/713. Acesso em: 7 apr. 2026.