Nguyen , C. N., Duong , H. N. and Dinh , V. Ánh (2012) “Research on the interconnection technologies between dies in the three-dimensional integrated circuits (3-d ics)”, Journal of Technical Education Science, 7(1), pp. 35–40. Available at: https://www.jte.edu.vn/index.php/jte/article/view/713 (Accessed: 7 April 2026).