Nguyen CN, Duong HN, Dinh V Ánh. Research on the interconnection technologies between dies in the three-dimensional integrated circuits (3-d ics). JTE [Internet]. 2012 Mar. 28 [cited 2026 Apr. 7];7(1):35-40. Available from: https://www.jte.edu.vn/index.php/jte/article/view/713